December 2008
Topic: Advanced BEOL Integration
CMP Process Application on the Phase Change Material
- Feng Liu, AMAT
The Changing Landscape for BEOL Etch (1.9MB pdf)
- John Arnold, IBM
Materials and Reliability Challenges for Cu Interconnects (3.3MB pdf)
- Paul Besser, AMD
High-Performance Nanostructured Films for Emerging Nanoscience and Biomedical Technologies
- Prof. Reinhold H. Dauskardt, Stanford University
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