April 2008
Topic: CMP Challenges & CMP Solutions - Focus on Consumables
Consumable Technologies to Cover a Wide Variety of CMP Applications (1.7MB pdf)
- Paul Feeney, Cabot Microelectronics
CMP Conditioner and Pad Characterization (3.9MB pdf)
- Len Borucki, Araca Incorporated
Advances in Colloidal Silica Particle Technology (Not Available)
- Kerry Lindemann, KLinde@rohmhaas.com, Rohm and Haas EM
Role of Online Communities and Planarization (3.9MB pdf)
- Robert Petrossian, InfoNeedle Inc.
Dressing of Resilient Pads for CMP of 32nm IC Wafers: Implications for Future Manufacture of 450mm Semiconductor Wafers (Large File Size: 20MB pdf)
- Michael Sung, Advanced Diamond Solutions
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