Announcements
Proceedings
Committee
Schedule
About
Join



CMP Users Group - Proceedings

July 2009
Topic Day 1: Business Aspects of CMP
Topic Day 2: CMP-New Advances and Emerging Technology

Day 1: Business Aspects of CMP

Impact of the Downturn on CMP (793k pdf)
- Mike Corbett, Linx Consulting, mcorbett@linx-consulting.com

Continued growth and benefits of CMP development and production outsourcing (1.3MB pdf)
- Frank Tolic, SVTC, Frank.Tolic@svtc.com

Weathering the Downturn—Techcet CMP Consumables 2009 Market Update (938k pdf)
- Mike Fury, Techcet Group, mfury@techcet.com

Addressing Pricing Pressures from a Filtration Company Perspective (572k pdf)
- Patrick Levy and Vivien Krygier, Pall Corporation, vivien_krygier@pall.com

Slurries and Particles—CMP and a bit beyond … 2009 Market (194k pdf)
- Karey Holland, Techcet Group, kholland@techcet.com

. . . . . . . . . . .

Day 2: CMP-New Advances and Emerging Technology

How Much Do We Really Know About the Chemical Reactions Occurred During Cu-CMP? (1.1MB pdf)
- Yuzhuo Li, BASF, yli@clarkson.edu

CMP Enables New TFT Architecture for 3D Monolithic Flash Memory (1.6MB pdf)
- Robert L. Rhoades1 and Andrew J. Walker2, 1 Entrepix, Inc., 2 Schiltron Corporation, rrhoades@entrepix.com

CMP Process Monitoring and System Interoperability Using Acoustic Emission (3MB pdf)
- Joshua Chien, Moneer Helu, David Dornfeld, DE Lee, University of California, Berkeley, jmchien@berkeley.edu

Models for Prediction of Correlations between Properties of CMP Molded Pads and Polish in G: Optimization of Process Quality and Pad Selection (N/A)
- Alexander Tregub, Intel, alexander.tregub@intel.com

The Effect of Pad Contact Area on Frictional Force and Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization (1.7MB pdf)
- Yun Zhuang1,2, Xiaoyan Liao2, Leonard Borucki1, Jiang Cheng2, Siannie Theng1, Toranosuke Ashizawa3 and Ara Philipossian1,2, 1 Araca, Inc., 2 University of Arizona, yunzhuang@aracainc.com

CMP Technologies for 45nm and Beyond (N/A)
- Joseph Steigerwald, Intel, Joseph.m.steigerwald@intel.com

CMP Optimization and Control through Real-Time Analysis of Process Effluents (1.2MB pdf)
- Stephen J. Benner and Darryl W. Peters, Confluense LLC, dwpeters@confluense.com

© Copyright 2011 American Vacuum Society