April 2010
Topic: CMP Consumables and Equipment
Current Status of CMP Process Characterization Wafers
- Soo Kap Hahn, SKW Associates, Inc. (NA)
Teaching Old CMP Equipment a Few New Tricks
- Robert L. Rhoades, Entrepix, Inc. (2MB pdf)
Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films
- Taek-Soo Kim and Reinhold H. Dauskardt, Stanford University (530k pdf)
Considerations on Dynamics of Defect Generation In CMP Technology
- Yehiel Gotkis, KLA-Tencor Corp. (7.7MB pdf)
Changing slurry formulations - Issues and Observations
- Majid Milani, SVTC Technologies (1.4MB pdf)
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