July 2010
Topic: New Frontiers for CMP
Taking Sides in the 450mm Wafer Debate (1.3MB pdf)
- Robert Castellano, The Information Network
Urethane Phoenix Rising - CMP Pads and Conditioners (904k pdf)
- Michael A. Fury, Techcet Group, LLC
A Completely New Playing Field - Slurry, PCMP & Others (946k pdf)
- Karey Holland, Techcet Group, LLC
An analysis of potential 450 mm chemical-mechanical planarization tool scaling questions (6.4MB ppt)
- Leonard Borucki, Ara Philipossian, Araca, Inc.; Michael Goldstein, Intel Corp.
A Closer Look at the China CMP World - Report from the Other Side of the Globe (NA)
- Shumin Wang, Anji Microelectronics, Inc.
BASF Soft Particles for Metal CMP (5.6MB pdf)
- Claus Poppe and Vijay Raman, BASF Microelectronics Materials
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