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| CMP Users Group - Proceedings |
| 2003 |
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May
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Characterization of Planarization Capability of Polishing Pad
Guangwei Wu, Thomas West, Inc.
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June
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Cu-Based Interconnect Post-CMP Cleaning
Chris Watts, ESC Inc.
Full Wafer-Scale Solution to Thin-Film Metrology for CMP
Sangbong Lee, Filmetrics, Inc.
Minimizing Particles During the Post CMP Cleaning Process
David J. Albrecht, Entegris
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December
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Effects of Aqueous Solution Chemistry on the Accelerated Cracking of Nanoporous Thin Films
Eric Guyer, Stanford University
Equipment and Material Integration Challenges
Lubab Sheet, Semi
Integration Issues With Cu CMP
Mike Oliver, Rodel
Modeling of pattern dependent pressure non-uniformity at die-scale for an integrated CMP model
Jihong Choi, UC Berkley
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