|
|
| CMP Users Group - Proceedings |
| 2004 |
 |
February
|
|
Fluid Film Lubrication in Chemical Mechanical Polishing
Gary S.H. Ng, Georgia Institute of Technology
Role of Glycine--H2O2 in Chemical Mechanical Polishing of Copper
Sharath Hegde, Clarkson University
The Orientation Effects in Shape Evolution in CMP
Edward Hwang, UC Berkeley
|
|
April
|
|
Development of a Planarized 3-Level Interconnect Module for Medical Devices with Resistor Films
Ralph Danzl , Medtronic, Inc.
The Low k Roadmap - A Materials Supplier Perspective ** Not Available, Click for more Information **
Mark O'Neill, Air Products and Chemicals
|
|
May
|
|
Advanced Slurry/Pad Technologies for Cu/Low-K CMP Process
Unknown, JSR Micro
Advanced Tungsten CMP with No Pad Conditioning
Robert Rhoades, Polishing Solutions International, LLC
Methods Of Defect Inspection and Detection For Copper CMP
Christopher Hawes, Cabot Microelectronics
Pad Conditioning Effects in Chemical Mechanical Polishing
A. Scott Lawing, Rohm and Haas Electronic Materials CMP Technologie
Polishing Pad Impact on the Yield on W CMP
Guangwei Wu, Thomas West, Inc.
|
|
December
|
|
Challenges in Cu/Low K Integration for Multilevel BEOL Wiring
Vincent McGahay, IBM
|
|
|
|
