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2005 Annual
Symposium Papers
CMP Users Group
- Proceedings
February, 2004
Fluid Film Lubrication in Chemical Mechanical Polishing
Gary S.H. Ng, Georgia Institute of Technology
Role of Glycine--H
2
O
2
in Chemical Mechanical Polishing of Copper
Sharath Hegde, Clarkson University
The Orientation Effects in Shape Evolution in CMP
Edward Hwang, UC Berkeley
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