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- Proceedings
2005
June
Advanced Barrier Slurry Development for 65nm and Beyond
Ken Delbridge, Planar Solutions L.L.C.
Advances in STI Process and Consumable Design
A. Scott Lawing, Rohm and Haas
Evolution of CMP Pad Conditioners & Abrasive Technology's Leadership Role
Sohail Qamar, Abrasive Technology
Fixed Abrasive Pad Development for Future CMP Process
Dr. T. V. (Jay) Jayaraman, MIPOX International Corporation
Innovation in ILD Polishing - Ultra-Low Defects and Reduced CoO
Alicia Walters, Cabot Microelectronics
Process Characterization of CMP Consumables
Rob Rhoades, Total Fab Solutions, Inc.
December
W Metallization in a 3-D Memory
Michael Konevecki, Matrix Semiconductor
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