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| CMP Users Group - Proceedings |
| 2002 |
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March
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Advanced In-Situ Endpoint Control System for CMP Applications
Charlie Shin, KLA-Tencor
Analysis and Prediction of Polish Profiling
Manabu Tsujimura, Ebara Corporation
CMP Outlook: Looking for a Better 2002
Robert Castellano, The Information Network
Cu CMP Cleaning with Aqueous, Alkaline Chemistry
Chris Watts, ESC
Outlook for CMP Consumables
Gil Yang, Salomon Smith Barney
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April
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High Power MegaSonic Cleaning in the CMP Application
Doug Swanson, ProSys Product Systems Inc.
New Processing Foams
Hal Bailey, BPT One Process
Post CMP Cleaning for STI Ceria Slurries
Robert Small, EKC Technology, Inc.
Post-CMP Cleaning Mechanisms - An Experiment-Combined-Numerical Analysis Approach
T. Zhang, University of Alaska Fairbanks
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June
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Copper and Low-k: Consumables Outlook
Dr. John Davis, Kline
Development of Copper Slurries for Advanced Technologies
Jeff Chamberlain, Cabot Microelectronics
Nitrogen-Based Slurry Development for Copper/Low-k (SiLKTM) Integration
Lily Yao, EKC Technology, Inc.
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August
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Hard Porous Pad for Copper CMP
Guangwei Wu, Thomas West, Inc.
Hitachi Chemical Metal CMP Slurry and Low-K Material
Shigeru Nobe, Hitachi Chemical
Integrated Copper CMP Barrier Slurry Development to Achieve Adjustable Rate Selectivity
Heather Rayle, Rodel
The Changing Needs of CMP: How to Design for Technology Shifts
B. Small, EKC Technology, Inc.
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September
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Advanced Techniques for Post-CMP Inspection: An Evolutionary Approach
K. Greissinger, Inspex
Copper CMP Metrology Solutions
Terence Boynton, KLA-Tencor
LuminaCu Reverse Linear CMP (RL-CMPTM) Technology for
<100nm Interconnect Applications
Mukeshi Desai, NuTool
Online Monitoring of Particle Size in CMP Slurries by SPOS, Requiring Little or No Dilution
David Nicoli, Particle Sizing Systems, Inc.
PadProbeTM for Quantitative Control of Pad Surface Conditions and Wear
Dr. Norm Gitis, Center for Tribology, Inc.
Polishing Pad Characterization with an In-Situ Metrology Instrument
Tuyen Vo, Tessellation
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October
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Chemical Modification of Particle Surfaces: Probing for Possible CMP Applications
Richard Partch (Invited), Clarkson
CMP Market and Technology Status 2002
Tom Tucker (Invited), Laredo
Copper CMP Challenges for ULK and Advanced Barriers
Ingrid Vos (Invited), IMEC
Copper CMP Gains Momentum
Saket Chadda (Invited), Sfam-IPEC
Gentle Chemical Mechanical Polishing of Copper/ Low K Based Interconnects
Rajeev Singh (Invited), University of Florida
Hard Porous PadTM for Copper Low K CMP
Guangwei Wu (Invited), Thomas West
Integration Issues and Challenges for Copper Low K Processes
Ajoy Zutshi (Invited), AMAT
Methods of Defect Detection and Inspection For Cu CMP
Chris Hawes (Invited), Cabot & KLA
NovaScan 2020Cu - Integrated Metrology in Copper CMP for 0.13µm and 0.09µm CMOS Platform Technologies
Kevin Cooper (Invited), Motorola & Nova
Opti-Probe Measurements of Low-k Porous SiLK Samples
Gregg Mandell (Invited), Thermawave
Poster 01 - SMART Pad for CMP
Sunghoon Lee, UC Berkeley
Poster 02 - High Throughput Planarization of Copper Damascene Structures
W. Scott Rader, Fujimi
Poster 03 - A Time Dependency CMP Model of Dishing and Erosion in Copper Damascene Process Based on Linear Viscoelasticity
Jianfeng Luo, UC Berkeley
Poster 04 - Obtaining Greater Process Control While Minimizing Particle Contamination
David J. Albrecht, NT International
Poster 05 - Filtration of Post-CMP DI Water and Ammonium Hydroxide for SynergyTM CMP Cleaning System
Budge Johl, Rodel, Inc.
Poster 06 - Effect of Feature Dimensions/Spacing and Dielectric Thickness on CMP Process Performance
Andrey Zagrebelny, Cypress Semiconductor Inc.
Poster 07 - Development of a Polishing Head for Low Pressure Process Focused on Cu/Low - k CMP
Katsunori Tanaka, ACCRETECH
Poster 08 - Dynamic Pot-Life and Handling Evaluation of Rodel CUS1351 Copper Barrier Slurry
Budge Johl, Rodel, Inc.
Poster 09 - Post CMP Aqueous and CO2 Cryogenic Cleaning Technologies for Low k and Copper Integration
Souvik Banerjee, EcoSnow Systems Inc.
Poster 10 - Investigation of Chemical Effect for the Application of the Fixed Abrasive Pad to Tungsten CMP
Haedo Jeong, Pusan National University
Poster 11 - Cu CMP Barrier Slurry Development to Achieve Adjustable Rates and Selectivities for Capped and Un-Capped Cu/Low-K
Qianqiu (Christine) Ye, Rodel, Inc.
Poster 12 - CMP of Dow SiLK Dielectrics for Technology Nodes Beyond 0.13um
K.H. Block, Rodel Inc.
Poster 13 - Reduced Slurry Usage utilizing Hard-PorousTM Polishing Pads
Harvey Pinder, Thomas West, Inc.
Poster 14 - Challenges of new low k films entail innovations in Post CMP Cleaning
Nathan Stein, Julia Svirchevski
Poster 15 - Handling Characteristics of Abrasive Free and Low Abrasive Copper CMP Slurries in Vacuum-Pressure Dispense System
Rakesh K. Singh, BOC Edwards
Poster 16 - Online Monitoring of CMP Slurries, Requiring Little or No Dilution, by Single-Particle Optical Sensing
David Nicoli, Particle Sizing Systems
Poster 17 - Macroscopic and Microscopic Modeling of Non-Uniformity Issues in CMP
Zhoujie Mao, UC Berkeley
Poster 18 - PadProbeTM for Monitoring and Control of Pad Surface
Dr. Norm V. Gitis, Center for Tribology, Inc.
Poster 19 - Novel In-Situ Technique for Polishing Pad Metrology
T. Vo, Tessellation
Poster 20 - Nanofiltration Based Electrowinning for Copper Waste Treatment
Gerald Krulik, BOC Edwards Hydromatix
The Removal of Micro and Nanoscale Particulate Defects
A. A. Busnaina (Invited), Northeaster University
The Semiconductor Market from Wall Street: Current Conditions,Outlook, and Low-k Issues
Gil Yang (Invited), Solomon Smith Barney
Tribology Case Studies for Copper Removal Optimization
David Craven (Invited), Lam
Tuning Hydroxylamine Slurries for Copper Barrier Polishing for SiLKtm Low-k Integration Processes (paper)
Bob Small (Invited), EKC & Dow Chemical
Tuning Hydroxylamine Slurries for Copper Barrier Polishing for SiLKtm Low-k Integration Processes (slides)
Bob Small (Invited), EKC & Dow Chemical
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