Announcements Proceedings Committee Schedule About Join	CMP Users Group - Proceedings August, 2002 Hard Porous Pad for Copper CMP   Guangwei Wu, Thomas West, Inc. Hitachi Chemical Metal CMP Slurry and Low-K Material   Shigeru Nobe, Hitachi Chemical Integrated Copper CMP Barrier Slurry Development to Achieve Adjustable Rate Selectivity   Heather Rayle, Rodel The Changing Needs of CMP: How to Design for Technology Shifts   B. Small, EKC Technology, Inc.
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