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Chemical Mechanical Polishing (CMP) is a technology for planarization used in the manufacture of silicon wafers, integrated circuits (IC's), magnetic heads and micro-electromechanical devices (MEMS). Its application has recently grown rapidly with its widespread implementation in the manufacture of IC's with sub-0.5 micron geometries.
The CMP Users Group (CMPUG) was formed in October 1995 to explore the issues and challenges associated with this fast growing technology. The CMPUG's main activity is a quarterly meeting with technical presentations on a topic of interest to the CMP community.
Admission to the quarterly technical meetings and membership in the CMPUG is FREE and open to anyone involved or interested in CMP Users Group, including those in device and equipment manufacturing, academia, or consulting.
The CMPUG has recently decided to co-sponsor an Annual International Symposium with the German, Japanese, Korean, and Taiwanese CMP Users Groups. The symposium has been named the International Conference on Planarization/CMP Technology (ICPT). This symposium will be hosted on a rotating schedule amongst the five Users Groups. ICPT '06 was held in the Foster City, CA USA, ICPT '07 was hosted by the German CMPUG in Dresden, Germany, ICPT '08 was hosted by the Taiwanese
User Group in Hsinchu, Taiwan, ICPT '09 was
hosted by the Japanese User Group in
Fukuoka, Japan. ICPT '10 will
return to the USA and take place in Phoenix,
AZ, November 14-18, 2010 and proceed to
Europe in 2011.
 To join, simply enter your contact info here. Once you are on the e-mail distribution list you will receive Call for Papers and Meeting announcements prior to each meeting.
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