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Chemical Mechanical Polishing (CMP) is a fast-growing integrated circuit manufacturing technology with equipment sales of $36 million in 1993 and projections of over $290 million for 1997. Two-thirds of the 93 semiconductor fabs planned for completion by 1997 will produce less than 0.5 micron geometries and will almost certainly use some form of CMP (Ref: Solid State Technology, p. 59, Oct. 1995).
The Chemical Mechanical Polishing Users Group (CMPUG) was formed in October, 1995 as a new subgroup of the NCCAVS to explore the technology and issues associated with this fast growing technology. The CMPUG's main activity is a quarterly meeting with technical presentations on a topic of current interest to the CMP community. Attendance at the meetings is approximately 60-80 people, and the e-mail distribution list includes over 900 members.
Admission to the quarterly technical meetings and membership to CMPUG is free and open to anyone involved or interested in chemical mechanical polishing, including those in device and equipment manufacturing, academia, or consulting. These meetings are excellent opportunities to interact with others involved with CMP.
The quarterly meetings are normally held on the first Wednesday of every month from 2:00-5:00 p.m. at Evans Analytical Group, LLC (unless otherwise specified). Please refer to the e-mail meeting announcement or schedule page for details and location.
To join, simply enter your contact info here. Once you are on the e-mail distribution list you will receive Call for Papers and Meeting announcements prior to each meeting.
We welcome your participation! If you would like to present the results of your work, suggest a session topic, or join the committee, feel free to contact someone on the Planning Committee (see Committee page for contacts) or send an e-mail Dave Slutz, 2008 CMPUG Chair, dave.slutz@morganplc.com.
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