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NCCAVS Marketing Opportunities

(138k pdf)

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Morgan Technical Ceramics

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ICPT 2016
October 17-19, 2016

Beijing, China
www.icpt2016.com

Abstract Deadline:
April 30, 2016
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CMP Users Group - Announcements

YOU MUST REGISTER FOR SEMICON WEST TO ATTEND THE CMP MEETING

Use the following link for Complimentary registration for NCCAVS User Group Members: https://www.xpressreg.net/register/SEMI0716/landing.asp?sc=GOSEMIN&aban=&hkey=&iq=&vip=&tm=&EmailID

Symposium Topic: CMP Technology and Market Dynamics
Meeting Date: July 14, 2016
Time: 10:00AM - 3:00PM

Location:

SEMICON West
Moscone Center - North Hall, Room 132


Symposium Co-Chairs:

Ashwani Rawat, Ph.D., Intel Corp, Ashwani.k.rawat@intel.com
David Hansen, Ph.D., Western Digital, david.hansen@hgst.com

Platinum Sponsors: Air Products, Applied Materials, DOW Chemical, Fujimi Corporation
Gold Sponsors: Kinik Company

AGENDA
10:00AM - 10:05AM Welcome and Introduction
- Ashwani Rawat, Intel Corporation

10:05PM - 10:30AM Research Activities on Defect Improvement of CMP Process in 1x nm Foundry Device:
- Ji-Chul Yang, Global Foundries (GF)

10:30PM - 10:50AM Nano-Capsule CMP Slurries: Enabling Localized Control of Chemical Exposure
- Robin Ihnfeldt, General Engineering & Research, L.L.C. (GE&R)

10:50PM - 11:10AM CMP’s Transition to 450mm Manufacturing: Current Status and Future Directions
- Christopher Borst1, Daniel Franca1, Huey-Ming Wang2
1- SUNY Polytechnic Institute, assignee to Global 450mm Consortium
2- GLOBALFOUNDRIES, assignee to Global 450mm Consortium

11:10AM - 11:30AM Strategic Evolution of CMP Supplier Base
- Mike Corbett, Linx Consulting

11:30PM-11:50AM Novel Method to Measure the Sharpness of CMP Pad Conditioner Abrasive Tips
- Charles Gould, 3M

11:50AM-12:10PM Advances in LPC Monitoring in CMP Slurries
- Mark Bumiller, PSS

12:10PM -1:00PM Networking/Lunch Break

1:00PM – 1:25PM Planarity Control Across Different Length Scales.
- Andrew Carswell, Micron Technology

1:25PM-1:45PM Scratch Reduction through new CMP Slurry Technologies
- Takafumi Sakurada, Hitachi Chemical Company, Japan.

1:45PM-2:05PM AIM Photonics solutions to CMP challenges with Integrated Si Photonics chips
- Frank Tolic, AIM-CNSE

2:05PM – 2:25PM Mechanistic Aspects of Wafer Cleaning After Chemical Mechanical Planarization
- Michael White, Entegris

2:25PM-2:45PM Nanoscale Chemical Imaging With Photo-Induced Force Microscopy
Sung Park, Molecular Vista Inc

2:45PM-3:00PM Symposium Wrap-up/Concluding Remarks
- David Hansen, HGST
- Ashwani Rawat, Intel Corp.

All presentations will be requested to be posted on the CMP Proceedings webpage.

If you would like to sponsor this meeting or list a banner ad on the User Group website, please contact Michael Pevny, CMPUG Sponsor Chair at: mpevny@mmm.com or check out our "NCCAVS Marketing/Sponsorship" opportunities at:
http://www.avsusergroups.org/misc_pdfs/NCCAVS_marketing_opportunities.pdf

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