SEMI Global Headquarters
Seminar rooms 1 & 2
3081 Zanker Road, San Jose, CA 95134
**Park in front or behind the vacant building across from SEMI**
Michael Pevny, 3M Company, firstname.lastname@example.org
- 2:00 - 2:05 Opening Remarks
- 2:05 - 2:30 Introducing a better CMP cleaning products: Brite Clean additives
- Geoffrey Yuxin Hu, Brizon Inc. and Lily Yao, Western Digital (WD)
- 2:30 - 2:55 Mechanism for LPC Pooling and Release in CMP Slurry Lines
- Mike Fury, Vantage Tech
- 2:55 - 3:20 Epic series soft polishing pads -CMC approach
- Jay Nair, Cabot Microelectronics
- 3:45 - 4:10 2014 Critical Materials Report: CMP Consumables
- Bob Roberts, TECHCET
- 4:10 - 4:35 3M Microreplicated Trizact (TM) Conditioning Disks for Front End Gate and Back End Bulk Tungsten Applications
- John Zabasajja, 3M Company
- 4:35 - 5:00 Improved Defect Performance and Reduced Slurry Consumption during CMP
- Christopher C. Choffat, IFS Services
WEBCAST WILL BE AVAILABLE DURING THIS MEETING FOR THOSE WHO CANNOT ATTEND IN PERSON.
Join the meeting: https://join.me/CMPUSERSGROUP
On a computer, use any browser with Flash. Nothing to download.
On a phone or tablet, launch the join.me app (https://join.me/app) and enter meeting code: CMPUSERSGROUP
Join the audio conference:
Dial a phone number and enter access code, or connect via internet.
United States +126.96.36.1996
Access Code 495-253-267#
Other international numbers available (https://join.me/intl)
By computer via internet:
Join the meeting, click the phone icon and select 'Call via internet'. A small download might be required.