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October 2008
Topic: Damage, Defects, Strain and Leakage
Modeling stress, defect evolution, and junction leakage (1.7MB pdf)
- Victor Moroz, Synopsis
Carrier recombination-based metrology tools for junction processing (5.7MB pdf)
- Michael Current, Current Scientific
Optimization of diffusion, activation and damage annealing in millisecond annealing (659K pdf)
- Paul Timans, Mattson Technology
Strain effects in millisecond laser annealing (813K pdf)
- Yun Wang, Ultratech
Automated differential-Hall profiling for defect characterization (722K pdf)
- Si Prussin, UCLA
In-line process and equipment performance monitoring using site flatness and Raman mapping (1.7MB pdf)
- Woo Sik Yoo, WaferMasters
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