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July 2011
Topic: Semiconductor and Solar Junction Technology
Introductions/Key Junction Technology Points from IWJT 2011, VLSI Symposium 2011 and 37th PVSC Conference (2.4MB pdf)
- John Borland, JOB Technologies
Solar Applications:
PN Junction Formation For Advanced High Efficiency Solar Cells: Theory, Technology & Equipment (984k pdf)
- Peter Fath, Centrotherm Photovoltaics USA
Design, modeling, and optimization of silicon solar cells (2MB pdf)
- Victor Moroz, Synopsys
BBr3 Boron Furnace Doping For High Efficiency N-Cells (1.5MB pdf)
- James Hwang, Amtech
Non-contact Analysis For Advanced Emitter Structures (980k pdf)
- Andrew Findlay, Semilab
Semiconductor Applications:
Effects of Cluster Carbon Implantation at Low Temperature on Damage Recovery after Annealing (4.6MB pdf)
- Hiroshi Onoda, Nissin Ion Equipment
New damage control techniques using SEN’s single wafer implanters (1.1MB pdf)
- Michiro Sugitani, SEN Corp.
Plasma Doping of Silicon Fin Structures (7.7MB pdf)
- Sue Felch, Ion Beam Services
Laser spike annealing for 2nm node and beyond (911k pdf)
- Jeff Hebb, Ultratech
Low thermal budget microwave semiconductor processing applications for 22nm devices (533k pdf)
- Jeff Kowalski, DSG Technologies
Optimizing Spike Anneals For 32nm ad Beyond (1.8MB pdf)
- Wolfgang Aderhold, Applied Materials
The measurement of strain enhanced mobility (345k pdf)
- Si Prussin, UCLA
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