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Junction Technology Group - Announcements
ADMISSION: Admission to attend SEMICON West is required to attend the TechSITE sessions. An Exhibits Only badge is needed unless you are already registered for SEMICON West. Register for a badge: at www.semi.org or at www.semiconwest.org/Participate/RegisterNow/index.htm.
Topic: New Junction Fabrication Capabilities: Implanters, Annealers, Materials and Metrology
Meeting Date: July 15, 2010
Meeting Time: 11:00 am - 3:00 pm
| Meeting Location: |
Moscone Convention Center
South Hall - TechSITE
San Francisco, CA
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| Co-chairs: |
John Borland, J.O.B. Technologies, johnoborland@aol.com
Michael Current, Current Scientific, currentsci@aol.com
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Agenda:
11:00-11:35 22nm Node p+ & n+ USJ Options,
-John Borland, J.O.B. Technologies.
11:35-12:10 Pulsion HP Plasma Doping,
-Susan Felch, Ion Beam Services
12:10-12:45 Millios millisecond flash anneal for 22nm node,
-Steve McCoy (or Sing-Pin Tay), Mattson Technology
12:45-1:45 Break for lunch
1:50-2:25 Laser Annealing for Ni-Silicide Yield Improvement,
-Jeremy Zelenko, Applied Materials
2:25-3:00 Laser Macro & Micro Uniformity Analysis Using Hx-4PP and TW,
-Walt Johnson, KLA-Tencor
3:00-3:35 Molecular Implant for Advanced
USJs,
-Wade Krull, SemEquip
NOTE: If you would like to sponsor this
meeting or list a banner ad on the User
Group website, please check out our
NEW 2010 Marketing/Sponsorship opportunities
at:
www.avsusergroups.org/misc_pdfs/form_ug_sponsor2010.pdf

Corporate Sponsorship Opportunities available at NCCAVS User Group Meetings!
For details please contact Heather Korff, NCCAVS Office, 530-896-0477, heather@avs.org.
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