Junction Technology Group - Announcements

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Topic: New Junction Fabrication Capabilities: Implanters, Annealers, Materials and Metrology

Meeting Date: July 15, 2010
Meeting Time: 11:00 am - 3:00 pm

Agenda:

11:00-11:35 22nm Node p+ & n+ USJ Options,
-John Borland, J.O.B. Technologies.

11:35-12:10 Pulsion HP Plasma Doping,
-Susan Felch, Ion Beam Services

12:10-12:45 Millios millisecond flash anneal for 22nm node,
-Steve McCoy (or Sing-Pin Tay), Mattson Technology

12:45-1:45 Break for lunch

1:50-2:25 Laser Annealing for Ni-Silicide Yield Improvement,
-Jeremy Zelenko, Applied Materials

2:25-3:00 Laser Macro & Micro Uniformity Analysis Using Hx-4PP and TW,
-Walt Johnson, KLA-Tencor

3:00-3:35 Molecular Implant for Advanced USJs,
-Wade Krull, SemEquip

NOTE: If you would like to sponsor this meeting or list a banner ad on the User Group website, please check out our NEW 2010 Marketing/Sponsorship opportunities at: www.avsusergroups.org/misc_pdfs/form_ug_sponsor2010.pdf

Corporate Sponsorship Opportunities available at NCCAVS User Group Meetings!
For details please contact Heather Korff, NCCAVS Office, 530-896-0477, heather@avs.org.