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Junction Technology Group - Announcements

SEMICON WEST 2014 MEETING
Topic: Ion Implantation and Annealing: New Process and Products

YOU MUST REGISTER FOR SEMICON WEST TO ATTEND THE JTG MEETING www.semiconwest.org

Meeting Date: Thursday, July 10, 2014
Time: Noon - 4:00 p.m.

Location:

SEMICON West
Moscone South,
West Mezzanine, Room 272

Co-Chairs:

Michael Current, currentsci@aol.com
John Borland, johnoborland@aol.com

Sponsors: AIBT, Axcelis, Ion Beam Services, Kingstone Semiconductor, Nissin Ion Equipment, SEN, Active Layer Parametrics, Core Systems, Evan Analytical Group, KLA-Tencor, Ultratech

Agenda:

12:00-12:25 Victor Moroz- Synopsis: "Materials engineering for 7 nm finFETs"

12:25-12:50 Dean Turnbaugh- Ion Beam Services: "Plasma doping of "hot" finFETs"

12:50-1:15 Michael Current- Current Scientific (with CORE Systems and Texas Instruments/Freising): "Elastomers for 30 C high-power implants for improved bipolar gain"

1:15-1:40 John Chen- Kingstone Semiconductor: "Extreme high-current beamlines"

1:40-2:05 Yoshiki Nakashima- Nissin Ion Equipment: "Heated ion implantation for SiC power devices"

2:05-2:30 Break (w/ ice cream)

2:30-2:55 Jeff Hebb- Ultratech: "Laser annealing for sub-20 nm devices"

2:55-3:20 John Borland- Advanced Integrated Photonics "Implant dopant activation in Si and Ge"

3:20-3:45 Abhijeet Joshi- Active Layer Parametrics: "Mobility and strain effects in doped junctions"

***Ice cream will be served in the mid-afternoon break.***

All presentations will be requested to be posted on the JTG Proceedings webpage.

If you would like to sponsor the JTG July Meeting at SEMICON West, please contact Michael Current, currentsci@aol.com


If you would like to sponsor this meeting or list a banner ad on the User Group website, please check out our "NCCAVS Marketing/Sponsorship" opportunities at: http://www.avsusergroups.org/misc_pdfs/2013_NCCAVS_marketing.pdf


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