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Plasma Applications Group - Proceedings

April 2010
Topic: Deposition

Advances in Helium Ion Microscope Imaging, Materials Analysis and Nanofabrication (NA)
- Bill Thompson, Carl Zeiss SMT, Inc.

Structure Designable Formation Technique of Super Low-k SiOCH Film by Neutral Beam Enhanced CVD (NA)
- Seiji Samukawa, Tohoku University

Uniformity and Quality of Monocrystalline Silicon Passivation by Thin Intrinsic Amorphous Silicon in a New Generation Plasma-enhanced Chemical Vapor Deposition Reactor (NA)
- Benjamin Strahm, Roth and Rau AG

Novellus PVD Technology for advanced node device and TSV application (NA)
- Alexander Dulkin, Novellus Systems

Low Temperature Deposition of PECVD Dielectric films (1.3MB pdf)
- Jason Taylor SVTC Technologies Inc.

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