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Plasma Applications Group - Proceedings

August 2010
Topic: Inspection and Metrology

Phosphorescent Decay, Infrared Radiation and Photoacoustic Spectroscopy: Techniques for Measuring Temperature and Gas Concentration, (1.5MB pdf)
- Lumasense Technologies

Design specific variation in via/contact pattern transfer-Full chip analysis, (5.9MB pdf)
-Valeriy Sukharev, Jun-Ho Choy, Ara Markosian, Armen Kteyan and Yuri Granik, Mentor Graphics Corp.; Vladimir Bliznetsov, Institute of Microelectronics, 117685 Singapore

PlasmaVolt in FEOL applications: An overview and some latest results for wafer-level metrology, (NA)
- Paul Arleo, KLA-Tencor and Alexey Milenin, et. al., IMEC

Secondary electron excitation source for plasma optical emission spectroscopy diagnostics, (778k pdf)
- Frank Mendoza , P.L. Stephan Thamban2, J. Hosch1, G. Padron-Wells2, A. Kueny1, K. Harvey1, M. Whelan1, M.J. Goeckner2, 1Verity Instruments, Inc.; 2University of Texas at Dallas

Real- time Monitoring Ion Flux and Ion Energy in plasma processes, (1.5MB pdf)
- Joe McGuire, Dr. Mike Hopkins, Donal O’Sullivan, Impedans Ltd.

Improving Etch Performance Using an In Situ Gas Flow Monitoring and Control System, (797k pdf)
- Kelly McDonough , Pivotal Systems

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