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Plasma Applications Group - Proceedings

November 2011
Topic: Metrology for Plasma Applications

EtchTemp Silicon Etch Wafer (2MB)
- Giampietro Bieli, KLA-Tencor

Ion energy distribution measurement at rf and pulsed biased electrodes
- M. B. Hopkins, P. Scullin, B. Dolinaj, D. O’ Sullivan and D. Gahan, Impedans Ltd.
(2.8MB)

Revisiting EEDF analysis methods for cylindrical Langmuir probes (1.4MB)
- Steve Shannon, North Carolina State University, Ahmed ElSaghir, Alexandria University (Egypt)

Frequency probe measurements of electron density, plasma potential, and electron energy distribution in processing plasmas* (NA)
- D. R. Boris, Plasma Physics Division, Naval Research Laboratory
* This work supported by the Naval Research Laboratory Base Program

Mass and energy spectrometry of processing plasmas (4.3MB)
- J. A. Rees, P. Hatton, D. Seymour, C. Greenwood and D. Lundy, Hiden Analytical

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© Copyright 2011 American Vacuum Society