Status of CMP for TSV's (785k pdf)
- Robert L. Rhoades, Entrepix, Inc. (rrhoades at entrepix.com)

Monolithic 3D DRAM Technology
- Deepak C. Sekar, Paul Lim, Brian Cronquist, and Zvi Or-Bach, MonolithIC 3D Inc. (Deepak at monolithic3d.com) (1MB pdf)

Multi-scale simulation and characterization for stress management in 3D IC TSV-based technology
- Valeriy Sukharev, A. Kteyan, J-H Choy, H. Hovsepyan, A. Markosian Mentor Graphics Corp. valeriy_sukharev at mentor.com (4.5MB pdf)

TSV Process Integration - A perspective on challenges and solutions
- Sesh Ramaswami, Applied Materials, Inc. (sesh_ramaswami at amat.com) (NA)