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Topic: Plasma Processing for Novel Materials
Meeting Date: April 29, 2013
Start Time: 1:30 - 5:00 pm
Agenda:
1:30–1:35 Welcome and Introduction
Kamatchi Subramanian
1:35–1:50 Introduction to Plasmas and Chemistries for Etching Novel Materials
Daniel L. Flamm, Microtechnology Law & Analysis, Walnut Creek, CA
1:50–2:20 Plasma Application in Read head and Magnetic Sensor,
Dr. Zheng Gao, Hitachi Global Storage, San Jose, CA
2:20-2:50 Integration of Disruptive Materials for Advanced Non-Volatile Memories
Wilbur Catabay, Telefunken Semiconductor International, Technology
Development & Commercialization Services, San Jose, CA
2:50–3:05 Break and Networking
3:05-3:35 Plasma Etching of Niobium
Travis Oh, D-Wave Systems, Burnaby, British Columbia
3:35-4:05 Real - Time Determination of Compositional profiles in structured materials using Laser Ablation and LA-ICPMSA
Alexander A. Bol'shakov, Jong H. Yoo, Jhanis J. Gonzalez, Richard E. Russo,
Applied Spectra Inc., Fremont, CA 94538
4:05 -4:35 Plasma Etching of SiC
Dr.Necmi Bilir, Consultant, Materials Research and Development, Palo Alto, CA.
4:35-4:45 Discussion, Questions, and Networking
