Effects of Plasma Etch and Ash Processes on Porous Low-k Film Surfaces in a Dual-Damascene Flow (2.2MB pdf)
- Yifeng Zhou, Yifeng_Zhou@amat.com, Applied Materials, Inc.; C.B. Labelle, GLOBALFOUNDRIES; D. Horak, IBM Research; K. Zhou, R. Patz, A. Darlak, J. Pender, Applied Materials, Inc.

Time-Resolved Two-Dimensional Wafer Surface Measurements for Process Optimization and Control (2MB pdf)
- Jeff Shields, jeffrey.shields@att.net, and Calvin Gabriel, Spansion, Inc., Greg Roche and Paul Arleo, KLA-Tencor

Valence-band Structure and Charge Trapping During VUV Irradiation of BEOL Dielectrics* (952k pdf)
- Jason L. Lauer, lauer@cae.wisc.edu, and J.L. Shohet, University of Wisconsin-Madison, A. Antonelli, Novellus, Inc., Y. Nishi, Stanford Universityl

Roles of vacuum ultraviolet radiation and ion bombardment in the roughening and degradation of photoresist polymers during plasma processing (1.9MB pdf)
- Dustin Nest, dgnest@berkeley.edu, T.-Y. Chung, J. J. Vegh and D. B. Graves, University of California, Berkeley; S. Engelmann, F. Weilnboeck, R. L. Bruce, T. C. Lin, R. Phaneuf and G. S. Oehrlein, University of Maryland, College Park; B. Long and G. Willson, University of Texas, Austin; E. A. Hudson, Lam Research Corp.; D. Wang, C. Andes, Dow Electronic Materials