March 2008
Topic: Front End Plasma Etch Applications
Shrink and Control Critical Dimension Using Dielectric Etch Chamber for 45nm Technology and Beyond (1.3MB pdf)
- Judy Wang, Shing-Li sung, Zhifeng Sui, Eda Tencel, Ajey Joshi, Peter Hseih, Shawming Ma, Jingbao Liu, Applied Materials, Etch Product Business Unit
Striation Free Technology (1.2MB pdf)
- K. Fujino, Philtech, Japan
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