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- Proceedings
May, 2004
Dual Damascene Etch; Challenges at the 65nm Node and Beyond
Makarem Hussein, Intel Corporation
Integrated Dual Damascene Etching for 65nm Technology and Beyond (9MB)
Yan Ye, Ph.D., Applied Materials
Repairing Process-Induced Damage to Porous Low-k ILDs by Post-Ash Treatment
Anil Bhanap, Honeywell Electronic Materials
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