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- Proceedings
July, 2005
A 300-mm Test Wafer To Evaluate Charging Damage
Fumio Otoi, Philtech
How To Avoid Charging Damage In IC Manufacturing
Wes Lukaszek, Wafer Charging Monitors, Inc.
Minimizing Plasma-Induced Charging Damage during Multi-Step Etching of Dual-Damascene Trench and Via Structures with Process Optimization
Michael C. Kutney, Applied Materials
Plasma damage and other concerns for 45 nm technologies
Calvin Gabriel, Advanced Micro Devices
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