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PE Users Group - Proceedings
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January
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Dual Frequency Dry Etching for Advanced Memory Applications
Robert Ditizio, Tegal Corporation
Dual Frequency Dry Etching for Advanced Memory Applications
Robert Ditizio, Tegal Corporation
In-band Spurs for a V-I probe caused by multi-frequency plasma effect
Yufeng Han, mks
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March
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Synergistic Effects of Gas Mixtures in a transformer-coupled toroidal plasma source for remote chamber cleaning
Herb Sawin, MIT Plasma Processing Group
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May
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Effect of Species Density and Ion Scattering During Ashing on Ultra Low-k Inter-Level-Dielectric (ILD) Materials
M.A. Worsley, Stanford University
Study and Reduction of Plasma Damage of Porous Ultra Low-k Dielectrics during Photoresist Stripping
Songlin Xu, mattson
Surface Texturing of 193nm Photoresist under Ar+ Bombardment: Effect of Ion Energy, Angle of Incidence and Substrate Temperature
D. Nest, University of California, Berkeley
The Transition from Saturated (c-C4F8) to Unsaturated (1,3-C4F6) Perfluorocarbons: Effects on Selectivity and ARDE in Via-hole Plasma Etch Applications
Teressa L. Anglinmatumona, AMD
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July
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Control of Contact Hole Distortion by Using Polymer Deposition Process (PDP) for sub-65nm Technology and Beyond
Judy Wang, Applied Materials
Etch Processes for Nano-scale Vertical MOS Devices
Hoon Cho, Stanford University
Integrated CD Shrink Methodologies for Contact Etch
Kang-lie Chiang, Applied Materials
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October
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Enabling DRIE processes for high potential MEMS products
Michel PUECH, Alcatel
MEMS Development at Maxim Using STS VPX
Yaqiang Wang, Dallas Semiconductor-Maxim
Optical MEMS platform for low cost on-chip integration of planar light circuits and optical switching
J. Kubby, UC Santa Cruz
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