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August 2008
Advanced FEOL Integration:
Phase Change Memory: A Memory Technology for All Applications (1.4MB)
- Dr. Stefan Lai
Advanced Activation Using Various Thermal Budget Regimes Such As Flash, Multiple Flashes And Flash + Spike Annealing (1MB)
- J. Gelpey, W. Lerch, S. Paul, J. Niess, S. McCoy, Sing-Pin Tay, Mattson Technology Inc.
Stress engineering and its interactions with high-k/metal gate and USJs (3MB)
- Dr. Victor Moroz, Principal Engineer, Synopsys, Inc.
Leakage Monitoring and Control with an Advanced e-Beam Inspection System (708K)
- Hong Xiao and Jack Jau, Hermes Microvision, Inc., San Jose, CA, USA, Hermes Liu, J H Yeh, Chan Lon Yang, S C Lei, J Y Kao, Y D Yang, Mingsheng Tsai, S F Tzou, Central R&D Division, United Microelectronics Corp., Taiwan, ROC
Front-End Materials and Process Needs (1MB)
- Prof. Tsu-Jae King Liu, University of California, Berkeley
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