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- Proceedings
October, 2002
Low k Challenges Beyond 100 nm
Osamu Aoki, JSR Microelectronics
Low-k Dielectrics for On-Chip Interconnect Applications
Peter Burke, LSI Logic
Metrology for Porous Low k Materials
Jennifer Spear, Technos International
Ultra-Low k Spin-on Polymer; Benefits, Challenges and Solutions for Damascene Integration
Don Frye, Dow Chemical
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