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June 2007
3-D Interconnect for Wafer Level Packaging:
Wafer-Level Three-Dimensional (3D) ICs (4.6MB pdf)
- Ronald J. Gutmann, Professor Emeritus, Rensselaer Polytechnic Institute
High Density Direct Bond Interconnect Technology for Three Dimensional Integrated Circuit Applications (1MB pdf)
- Paul. M. Enquist, Ziptronix, Inc.
3D Interconnect: Architectural Challenges & Opportunities
- Tim Sherwood, UC Santa Babara
A Novel Bonding Mechanism Using Aluminum-Induced Crystallization of Amorphous Silicon (653k pdf)
- Markus D. Ong & Reinhold H. Dauskardt, Stanford University
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