Announcements
Proceedings
Committee
Schedule
About
Join
2005 Annual
Symposium Papers
TF Users Group
- Proceedings
November, 2003
A Study of Dilute Cu Alloys for Dual-Damascene Interconnect Applications
Eal Lee (email:
Eal.Lee@Honeywell.com
), Honeywell Electronic Materials
SE & GXR Reflectometry Analyses on Tungsten Carbide (WCx) Films For Diffusion Barrier in Copper Metallization Schemes
Adrien Darragon, SOPRA, Inc.
© Copyright 2009 American Vacuum Society
