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- Proceedings
November, 2003
A Study of Dilute Cu Alloys for Dual-Damascene Interconnect Applications
Eal Lee (email:
Eal.Lee@Honeywell.com
), Honeywell Electronic Materials
SE & GXR Reflectometry Analyses on Tungsten Carbide (WCx) Films For Diffusion Barrier in Copper Metallization Schemes
Adrien Darragon, SOPRA, Inc.
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