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- Proceedings
2004
March
Advances in Thin Film Metrology for MRAM
Mark Willingham, ADE Corporation
Current Status of Phase Change Memory and its Future
Stefan Lai, Intel Corporation
MRAM: A New Technology for the Future
Kamel Ounadjela, Cypress Semiconductor
August
Integrated Metrology System for Metallization Process
Gai Chin, ULVAC
Jets-ECD (JECD) and Multiple Seed Layers for Copper Interconnects < 0.10mm
Uri Cohen, UC Consulting
Metallurgical Considerations for PVD Materials
Heiner Lichtenberger, Williams Advanced Materials
December
Challenges in Cu/Low K Integration for Multilevel BEOL Wiring
Vincent McGahay, IBM
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