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TF Users Group - Proceedings
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| 2005 |
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February
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Metrology of: SOI, SiGe/SGOI, Strained Si, Bipolars and others
Laurent Kitzinger, SOPRA SA
Modern SOI Materials
Jean-Pierre Colinge, University of California, Davis
SiGe Epi deposition for NPN HBT base layer
Sagy Levy, Cypress Semiconductor Process R&D
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May
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Equipment Supplier’s Perspective on the Evolution of Si Technology Development
Gregg S. Higashi, Ph.D., Applied Materials
Optical Measurement of Thickness and Properties of Ultra-Thin Films in Complex Multi-Layer Film Stacks Used in MRAM Fabrication
Alexander Gray, n&k Technology, Inc.
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June
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CVD deposited low k dielectrics for gap-fill applications.
John Macneil, Trikon Technologies, Inc.
Optical Metrology of Low-k Dielectrics
Phillip Walsh, n&k Technology, Inc.
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September
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Comprehensive Metrology Tools for Characterization and Measurements of Ultra-Thick Films, Determination of Optical Properties of Materials
John Lam, n&k Technology, Inc.
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December
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W Metallization in a 3-D Memory
Michael Konevecki, Matrix Semiconductor
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