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TF Users Group - Proceedings
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| 2006 |
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February
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Development Low H Damascene SiN for Advanced FLASH Cu BEOL
Alex Níkel, Advanced Process Development, Advanced Micro Devic
Pure-Silica-Zeolites as Low-k Materials
Zijian Li, University of California, Riverside
The Case For High Aspect Ratio (HAR) Interconnects
Uri Cohen, UC Consulting
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April
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Device and Technology Challenges for Nanoscale CMOS
H.-S. Philip Wong, Stanford University
Gate Stack Scaling, Challenges and Approaches in Meeting Technology Requirements
Yi Ma, Applied Materials
New Devices to Extend Scaling of Non-volatile Memory
Zoran Krivokapic, AMD
Pulse Nucleantion Layer (PNL) WN/W and Its Application on Direct Contact Fill
Juwen Gao, Novellus
Siconi Preclean for FEOL Applications
Xinliang Lu, Applied Materials
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August
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The Impact of Power Supply Arc Response on Production Yield and Field Reliability
D.J. (Dave) Christie, Advanced Energy Industries, Inc.
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