Diagnosing Adhesion and Cohesion for BEOL Reliability: From Dieseals and Crack Stops to Cu and Low k
  - Reinhold H. Dauskardt, Stanford University

Angle Resolved x-ray Photoelectron Spectroscopy, ARXPS– Experience in the Wafer Processing Industry so far (ppt)
  - C.R. Brundle, C.R. Brundle & Associates

Surface Scattering Technique for Micro-roughness Characterization
  - Uday Mahajan, KLA-Tencor