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April 2007
Diagnostics:
Diagnosing Adhesion and Cohesion for BEOL Reliability: From Dieseals and Crack Stops to Cu and Low k
- Reinhold H. Dauskardt, Stanford University
Angle Resolved x-ray Photoelectron Spectroscopy, ARXPS– Experience in the Wafer Processing Industry so far (ppt)
- C.R. Brundle, C.R. Brundle & Associates
Surface Scattering Technique for Micro-roughness Characterization
- Uday Mahajan, KLA-Tencor
Micromechanical Testing of Thin Films (ppt)
- Warren Oliver, MTS Nano Instruments
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