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TF Users Group - Proceedings
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| 2002 |
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February
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Comments at AVS Panel Discussion
M. David Levenson, Microlithography World
IC Industry Lithography Requirements and Nikon's Plans
J.C. Wiesner, Nikon Precision Inc.
Massively Parallel Direct Write E-Beam System
H.F. Lockwood, Emission Systems, LLC
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March
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ALD W and TiN for Advanced Contact Application
Alex Yoon, Applied Materials
Scaling Induced Performance Limitations of Metal Interconnects
Krishna Saraswat, Stanford University
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April
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Properties and Applications of Strained Si/SiGe
Dr. Annalena Thilderkvist, Applied Materials
Roadmap of SiGe BiCMOS Technologies
Greg U'Ren, Conexant Systems
Silicon-Germanium: from Microelectronics to Micromechanics
Tsu-Jae King, University of California, Berkeley
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May
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High-k Gate Dielectrics: Novel Growth Methods,Interface Structures and Electrical Properties
S. Ramanathan, Stanford MSE
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June
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InGaAsN: A Promising Material for Long Wavelength Vertical Cavity Lasers
Michael Leary, Agilent Technologies Laboratories
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July
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Scanning Probe Microscopy: An Ultimate Tool for Nanoscience and Nanotech
Lin Huang, PhD, Veeco Metrology Group
Thin Film Metrology at Applied Materials: Present and Future
Abner F. Bello, Applied Materials
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August
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Cu Plating Today and Tomorrow: Managing the Terminal Effect
John Klocke, Semitool
Thermal Stress and Reliability Characterization of Cu Interconnects
Katsuyuki Musaka, Applied Materials, Inc.
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October
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Low k Challenges Beyond 100 nm
Osamu Aoki, JSR Microelectronics
Low-k Dielectrics for On-Chip Interconnect Applications
Peter Burke, LSI Logic
Metrology for Porous Low k Materials
Jennifer Spear, Technos International
Ultra-Low k Spin-on Polymer; Benefits, Challenges and Solutions for Damascene Integration
Don Frye, Dow Chemical
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November
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Barriers
John Forster, Applied Materials, Inc.
Cu Seed Layers: Do It Right By Design (Why Repair?)
Uri Cohen, Ph.D., UC Consulting
Microstructural Characterization of Copper Interconnects
Paul R. Besser, AMD
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December
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Alternating Layer Deposition of Dielectric Films
A.P. Paranjpe, TORREX
Fundamental Vacuum Beam Studies of Radical Enhanced Atomic Layer Chemical Vapor Deposition (REALCVD)
Frank Greer, Ph. D., Novellus Systems, Inc.
The PE-ALD of Ta Based Metals/Nitrides: The Growth, Materials Properties, and Applications to Future Device Fabrications
Hyungjun Kim, IBM
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