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ICPT 2008
Hsinchu, Taiwan
Nov 10-12, 2008

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Junction Technology Group - Announcements

Semicon West 2008 - July 17, 2008
FREE ADMISSION—No need to register, just show up!!

Topic: USJ Formation for 32nm Node
Meeting Date:
July 17, 2008
Time: 8:30 am – 6:00 pm

Sponsored by:
  • Matheson Tri-Gas
  • AIBT
  • Axcelis
  • TEL-Epion
  • SemEquip
  • UJT
  • Dai Nippon Screen
  • Mattson
  • Ultratech
  • KLA-Tencor

Meeting Location:   Semicon West 2008
Moscone North
Room 124
San Francisco, CA


Co-Chairs: John Borland, johnoborland@aol.com
Susan Felch, susan.felch@spansion.com
Kavita Murthi, kmurthi@matheson-trigas.com
Michael Current, currentsci@aol.com

Agenda:

8:30-8:55AM: FREE REGISTRATION OPENS

8:55-9:00AM Welcome/Introduction

9:00-9:35AM: Synopsys: Ignacio Martin-Bragado, “Modeling of temperature, stress, defects and dopant activation in Si, SiGe and SiC during spike and msec annealing for 32nm node”

9:35-10:10AM: Spansion: Sue Felch, “32nm node shallow junction problems and solutions”

10:10-10:45AM: Mattson: Paul Timans, “fRTP update for 32nm node”

10:45-11:20AM: DNS: Hiroki Kiyama, “FLA update for 32nm node”

11:20-11:55AM: Ultratech: Jeff Hebb, “LSA update for 32nm node”

11:55-1:00PM LUNCH (provided)

1:00-1:35PM: Axcelis: Mark Harris, “Single wafer implantation process matching issues”

1:35-2:10PM: SemEquip: Wade Krull, “Cluster Implant for 32nm”

2:10-2:45PM: UJT: Bunji Mizuno, “Plasma doping”

2:45-3:05PM: BREAK

3:05-3:40PM: TEL-Epion: Nathan Baxter, “Infusion doping for 32nm node”

3:40-4:15PM: JOB Technologies: John Borland, “32nm node USJ formation using Rapid Process Optimization Metrology”

4:15-4:50PM: KLA-Tencor: Brian Chung, “TW metrology for implant and annealing at 32nm node”


Corporate Sponsorship Opportunities available at NCCAVS User Group Meetings!
For details please contact Heather Korff, NCCAVS Office, 530-896-0477, heather@avs.org.

© Copyright 2008 American Vacuum Society